More
    HomePress ReleaseRohde & Schwarz Mobile Test Summit on trends in wireless communications –...

    Rohde & Schwarz Mobile Test Summit on trends in wireless communications – sessions available online now

    This year’s Mobile Test Summit occurred from November 28 to November 29, 2023. Wireless communications professionals came to the Rohde & Schwarz headquarters in Munich for two days of insights into the latest developments in mobile device and infrastructure testing. The event explored a wide range of topics, with a focus on the next wave of 5G and early 6G: non-terrestrial networks (NTN), reduced capability (RedCap), mission-critical communications (MCx), terahertz (THz), spectrum for 6G, metaverse and XR. Other important topics were the latest advancements in broadband technologies (such as Wi-Fi 7), Open Radio Access Networks (O-RAN), advanced multiple input multiple output (MIMO) and beamforming.

    For those interested in these topics but unable to join in person, Rohde & Schwarz offers on-demand recordings of all the presentations. The international speaker line-up includes leading IoT companies, O-RAN suppliers, chip manufacturers and satellite communications service providers:

    • Lars Wehmeier and Volker Breuer from Telit Cinterion on expanding IoT devices and their uses with 5G RedCap
    • Harald Ludwig from Arico Technologies on MCx
    • Adrian O’Connor from Benetel on O-RAN
    • Peadar Forbes from Analog Devices on critical design considerations for massive MIMO and beamforming
    • Marko Keskinen from Skylo Technologies on direct-to-device satellite connectivity
    • Tilo Heckmann from Telefonica Germany on NTN operator perspective
    • Marco Guadalupi from Sateliot on 5G NB-IoT NTN coverage extension
    • Sandro Scalise from the German Aerospace Center on resilient 3D networks
    • Hans Joachim Schulze from Vodafone on conformance testing
    • Michael Grundl from LANCOM on Wi-Fi 6E and Wi-Fi 7

    Alexander Pabst, Vice President of Wireless Communications at Rohde & Schwarz, says, “Rapid advancements in the mobile ecosystem make it vital to address testing challenges. This year’s Mobile Test Summit provided a platform for truly meaningful dialogue on the latest developments in wireless communications. Our recordings of the event provide a window into two days of lively discussion, offering curated insights from industry leaders and Rohde & Schwarz technology experts.”

    Himanshu Vaibhav
    Himanshu Vaibhavhttps://www.timesev.com/
    Himanshu Vaibhav is a distinguished Technology Journalist associated with ELEtimes.com and TimesEV.com. With expertise in researching, writing, and editing, he demonstrates a deep understanding of technology, particularly in the EV industry. His continuous updates on EV, Automotive, and E-mobility industries reflect his commitment to staying at the forefront of emerging trends.

    Related Post

    Most Popular

    Best Picks

    X-CUBE-STL: Supporting more STM32s and sharing resources to demystify functional safety

    Author: STMicroelectronics X-CUBE-STL now supports the STM32MP1, the STM32U5, the STM32L5, the STM32H5, and the STM32WL. In essence, the most extensive family of general-purpose microcontrollers capable of running Safety Integrity Level 2...

    STMicroelectronics presented Next Gen and Sustainable solutions at electronica...

    Driving Innovation in Efficiency, Precision, and AI-Enabled Solutions STMicroelectronics has introduced a series of cutting-edge innovations, empowering developers in motor control, edge AI, sensor fusion,...

    Understanding Fire Risks in Electric Vehicles (EVs)

    Recent findings indicate that electric vehicles (EVs) do not present a higher fire risk compared to conventional gasoline-powered vehicles. Andrew Klock, a senior manager...

    STPOWER Studio: 3 new topologies for accurate electro-thermal simulation...

    Author: STMicroelectronics STPOWER Studio 4.0 just became available and now supports three new topologies (1-phase full bridge, 1-phase half-bridge, and 3-phase 3-level T-NPC) to cover significantly...

    What is an STM32 MPU? Understanding the new realities...

    Author: STMicroelectronics What’s the difference between a microcontroller (MCU) and a microprocessor (MPU)? In simplistic terms, both are the brains of an embedded system. A few...

    From basic training to world-class competitions: MEMS sensors in...

    Author: STMicroelectronics With the global spotlight on sports these days, it is almost impossible to overlook the technological innovations like the MEMS (Micro-Electro-Mechanical Systems) sensors. Embedded in wearable...

    STM32WB0x: Meet all the new wireless STM32WBs that will...

    Author: STMicroelectronics ST is launching the STM32WB05 and the STM32WB06/07, thus extending the STM32WB0 series inaugurated late last year with the introduction of the STM32WB09. The new family fully realizes...

    DEP Meshworks: Pioneering CAE Innovations for EVs and Autonomous...

    Detroit Engineered Products (DEP) is a global Engineering Solutions and Product Development company with a rich 25-year legacy. Since its inception in 1998 in...

    “India’s Electric Vehicle Revolution: Navigating Challenges and Seizing Opportunities...

    The EV industry of the nation is witnessing a tectonic boom. With the advent of government policies about a clean and green environment, the...

    Must Read